I would double check that nothing close to the SD-card reader has been shorted by the new wires.
And then I would re-heat each of the pins of the SD-card reader. And before re-heating, I would add some flux, or while re-heating; add some solder using a thin solder wire. I have a 0.6 mm solder, that I use for such events.
Soldering things close to the pads of the SD-card-reader-pads can, in rare situations, cause the solder-connection of the SD-card-reader-pads to become a little loose, and creating a "cold" solder-joint. Cold-solder-joints are a pain to deal with, as they visually appear to be just fine, but electrically they are not fine.
I would pay special attention to the SD-card-reader-pads close to the new wires - and make sure to add a little extra solder to those pads.
Cold-solder-joint events, on equipment that used to work just fine, is the new scourge of non-leaded-solder. For these events to occur though, it is usually necessary that a high-temperature-event (or repeated very-warm-temperature-events) has happened in close proximity to the newly-created cold-solder-joint pad. But soldering in those new wires, might just have been that close-by high-temperature-event.
And then I would re-heat each of the pins of the SD-card reader. And before re-heating, I would add some flux, or while re-heating; add some solder using a thin solder wire. I have a 0.6 mm solder, that I use for such events.
Soldering things close to the pads of the SD-card-reader-pads can, in rare situations, cause the solder-connection of the SD-card-reader-pads to become a little loose, and creating a "cold" solder-joint. Cold-solder-joints are a pain to deal with, as they visually appear to be just fine, but electrically they are not fine.
I would pay special attention to the SD-card-reader-pads close to the new wires - and make sure to add a little extra solder to those pads.
Cold-solder-joint events, on equipment that used to work just fine, is the new scourge of non-leaded-solder. For these events to occur though, it is usually necessary that a high-temperature-event (or repeated very-warm-temperature-events) has happened in close proximity to the newly-created cold-solder-joint pad. But soldering in those new wires, might just have been that close-by high-temperature-event.